BIWIN: OEC Product Undergoing Joint Development with Clients for a 6.4TNPO Optical Engine Package, with R&D Set to Wrap Up in Q4 2026

19 hour ago / Read about 0 minute

Author：小编

On September 22, BIWIN revealed on an interactive platform that the company is harnessing cutting-edge packaging technologies to construct an ecosystem that fully encompasses the three pivotal domains of AI hardware infrastructure: storage, computing, and transmission. Among these, the company's emphasis on the development of the high-speed signal transmission OEC (Optical-Electrical Co-Packaging) series caters to the requirements for ultra-high-speed interconnection. At present, BIWIN is working hand-in-hand with clients to develop a 6.4TNPO optical engine package, with the research and development phase projected to conclude in the fourth quarter of 2026.

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