VCP Plating Equipment for Optical Modules from Sunfine New Material Tech Has Been Dispatched
4 day ago / Read about 0 minute
Author:小编   

Recently, Sunfine New Material Tech made an announcement: the VCP plating equipment for optical modules, which was independently developed by its subsidiary Mingyi Electronics, has been dispatched and is on the verge of being delivered to a prominent domestic AI server PCB manufacturer. This particular series of equipment can be tailored to fulfill the demands of PCB plating and IC substrate plating processes for cutting-edge technologies like mSAP. Moreover, it is well-suited for PCB plating processes pertaining to optical modules spanning from 800G to 1.6T.