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The Huawei Full Connect Conference 2026 kicked off in Shanghai. During his keynote address, Wang Tao, Vice Chairman and Rotating Chairman of Huawei, unveiled a series of remarkable advancements: Over 1,000 sets of Ascend 910C super nodes have been successfully deployed, and Ascend 950 super nodes have achieved large-scale commercial availability. The development of the Ascend 960 chip has surpassed expectations, with the 960DT variant set to be completed three quarters ahead of schedule in the first quarter of 2027, and the 960PR variant one quarter ahead, slated for readiness in the third quarter of 2027. Looking ahead, the Ascend series will sustain an annual evolution pace, with the 970 and 980 chips scheduled for launch in 2028 and 2029, respectively.
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