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TSMC Steps Up 2nm Production Capacity Expansion: Aims for 110,000 Wafers per Month by Mid-2027, Outpacing 3nm Growth
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Author：小编
Fueled by the skyrocketing demand for AI and high-performance computing chips, TSMC is ramping up its efforts to expand its advanced process production capabilities. The latest updates from the supply chain reveal that TSMC has plans to significantly boost its 2nm and 3nm process production capacities in 2027. Notably, the expansion pace for the 2nm process is set to outstrip that of the 3nm process by a considerable margin. By mid-2027, it is anticipated that the monthly production capacity for the 2nm process will surge to around 110,000 wafers. In comparison, the monthly production capacity for the 3nm process is projected to reach approximately 210,000 wafers.
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