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Samsung and Qualcomm are deepening their partnership within the semiconductor industry, building upon their existing collaboration in 2.1D advanced packaging technology. Their shared objective is to develop chip interconnect solutions that offer greater density and speed for the upcoming generation of high-performance computing and AI chips. This partnership leverages embedded organic bridges, a design philosophy akin to Intel's EMIB, yet innovates by substituting silicon bridges with more economical organic materials. This strategic substitution not only cuts costs but also circumvents potential patent issues. This initiative marks a pivotal advancement for Samsung in refining its advanced packaging technology framework and bolstering its competitive edge in the AI chip packaging arena.
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