On September 14, at the 2026 mid-year performance briefing, Cheng Zhuo, Chairman of Canon Kejia, announced that the company anticipates a continued strong delivery of high-end PCB equipment orders in the latter half of the year. He also mentioned that advanced packaging equipment is now entering the verification and implementation stages. Looking ahead to next year, the expansion of AI servers, associated carrier boards, and advanced packaging technologies is projected to spur additional demand for equipment.

During the first half of the year, Canon Kejia's Phase II plant was in the process of ramping up production, achieving high overall capacity utilization. The company expects to fully unleash the capacity of Phase II in the second half of the year. By leveraging modular production techniques and pre-stocking essential components, Canon Kejia is well-positioned to continue accepting orders for high-end PCB and advanced packaging equipment.