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Apple is set to unveil its first 2-nanometer process iPhone chip, the A20 Pro, at the September 9 event, adopting WMCM packaging technology to replace the original InFO_PoP solution. This technology integrates the CPU, GPU, NPU, and memory at the wafer level, significantly enhancing data transmission efficiency and thermal performance. A bare die photo of the A20 Pro reveals an increased number of GPU cores, which, combined with the 2-nanometer process and WMCM packaging, delivers a 15% performance boost and a 30% increase in energy efficiency, while supporting 135 trillion AI operations per second. The chip will debut in the iPhone 18 Pro series and the first foldable iPhone Ultra, marking Apple's technological breakthrough in the mobile chip sector.
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