On August 30th, TCL Technology disclosed during institutional research that the prevailing glass-based advanced packaging technology necessitates 20 layers for the packaging of high-computing-power, high-performance chips. Presently, TCL Technology is harnessing external resources to forge a technological pathway and ready comprehensive samples. Owing to external technical limitations, the samples slated for release in the latter half of this year are anticipated to feature approximately 12 layers, thus falling short of the 20-layer benchmark. Should the sample performance and technological pathway align with expectations, the company will embark on constructing a pilot production line within the current year.