On August 28, Gowin Semiconductor Technology Corporation obtained the green light for its IPO registration from the China Securities Regulatory Commission (CSRC), marking a significant milestone as it became the first wafer fabrication enterprise to gain approval under the registration-based system for the ChiNext board. Backed by GF Securities as its sponsor, the company's IPO application journey spanned over eight months, culminating in plans to go public on the ChiNext board of the Shenzhen Stock Exchange and raise 7.5 billion yuan.

Founded in 2017 in Guangzhou's Huangpu district, Gowin Semiconductor embarked on mass production at its Phase I production line in 2019, earning the accolade of being Guangzhou's 'pioneer chip'. The company focuses on three core areas: integrated circuits, power devices, and optoelectronic integration. By the end of 2025, it boasts a portfolio of over 700 authorized patents, both domestically and internationally, including more than 340 invention patents. Its silicon photonics process platform has initiated over 3,500 wafer starts, with products catering to 400G, 800G, and 1.6T high-speed silicon pluggable optical module applications.

Presently, Gowin Semiconductor's Phase I and Phase II facilities are operating at full throttle, achieving a monthly production capacity of 63,300 wafers by the end of 2025. Construction has already commenced on Phase III, which, upon completion, is expected to elevate the total monthly capacity to 120,000 wafers. From 2023 to 2025, the company witnessed an impressive average annual compound revenue growth rate of 57.30%, with overall profitability anticipated as early as 2029.