On August 27, 2026, SK Hynix held a groundbreaking ceremony in West Lafayette, Indiana, USA, for its first advanced memory chip packaging plant. Spanning 133.5 acres with a total investment exceeding US$4 billion, the plant will become SK Hynix's first high-bandwidth memory (HBM) packaging base in the United States. The plant's cleanroom is expected to be operational by October 2028, with mass production slated to commence in the second half of 2029, and it is projected to create over 1,000 jobs.