On August 27, SK Hynix held a groundbreaking ceremony to mark the start of construction on a state-of-the-art memory packaging plant in Indiana, USA. With an investment surpassing $4 billion and sprawling across 133.5 acres, this facility is set to become SK Hynix's inaugural high-bandwidth memory (HBM) packaging site in the United States once completed. Kwak Noh-Jung, CEO of SK Hynix, revealed that the factory's cleanroom is slated to be up and running by October 2028, paving the way for mass production of next-generation HBM to kick off in the latter half of 2029. Upon reaching full operational capacity, the project is anticipated to generate around 1,000 job opportunities and emerge as a pivotal HBM production center.