SK Hynix held a groundbreaking ceremony for an advanced memory packaging plant in West Lafayette, Indiana, USA, marking a significant step in the United States' efforts to rebuild its domestic supply chains and manufacturing sector. The plant will become SK Hynix's first high-bandwidth memory packaging base in the United States, with the cleanroom expected to open in October 2028 and mass production to commence in the second half of 2029. Supported by the U.S. CHIPS and Science Act, the project will create job opportunities and strengthen the U.S. AI chip supply chain. SK Hynix also plans to expand its investments and collaborations in the United States.