On August 27, SK Hynix held a groundbreaking ceremony on Thursday for its advanced memory packaging facility in West Lafayette, Indiana, USA. With an investment exceeding $4 billion and covering an area of 133.5 acres, the factory will become SK Hynix's first high-bandwidth memory (HBM) packaging base in the United States. SK Hynix CEO Kwak Noh-Jung stated that the factory's cleanroom is expected to be operational by October 2028, with mass production of next-generation HBM scheduled to commence in the second half of 2029. Once fully operational, the factory will become a significant HBM production hub, Expected employment (expected to employ) approximately 1,000 people.