During the Hot Chips conference, Intel divulged further specifics regarding its innovative 18A-P process technology. This cutting-edge technology leverages Gate-All-Around (GAA) transistors, Backside Power Delivery (GAA-BSPD) mechanisms, and Power Boost capabilities, coupled with an augmented number of metal layers. Notably, under low-voltage conditions, this process can significantly elevate the operational frequency of mass-produced x86 silicon wafers by as much as 30%, marking a substantial advancement in semiconductor performance.