The packaging production line upgrade project of Nanjing ThinkSemi Technology, situated in the Pukou Economic Development Zone, has achieved a fresh milestone. Backed by a substantial 1.1 billion yuan investment from Jiangsu ThinkSemi Semiconductor Technology Co., Ltd., this endeavor is centered on bolstering high-end semiconductor packaging capabilities and augmenting production scale. Launched in February 2025 and earmarked for full-scale completion and operationalization by 2026, the project leverages a sprawling 60-mu factory complex. It is projected to yield an impressive annual output value surpassing 1.8 billion yuan once it reaches full operational capacity. Presently, the procurement of equipment for the project has surpassed the 80% mark, with half of the procured equipment already in the installation and commissioning stages. Notably, the localization rate for wafer-level packaging equipment has achieved a perfect 100%, while system-level packaging equipment boasts a commendable 70% localization rate.