Shanghai: Boosts R&D Efforts in New Material Devices like Two-Dimensional Materials, Advances Design and Tape-out of 3D Stacked Architecture Chips
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Author:小编   

On August 26, the General Office of the Shanghai Municipal People's Government unveiled the 15th Five-Year Plan for the Development of Strategic Emerging Industries in Shanghai. This plan underscores a strategic, forward-looking approach in pivotal sectors, aiming to comprehensively elevate the overall caliber of the integrated circuit industry. The key areas of focus include:

Firstly, high-end chips and AI-driven design. The plan calls for accelerating the R&D and industrialization of high-end chips, constructing vertical models and agents tailored for chip design, and harnessing AI technology to streamline design processes and expedite simulations.

Secondly, advanced packaging technologies. It promotes the R&D and widespread application of cutting-edge packaging technologies, while also supporting the development of packaging equipment and materials.

Thirdly, innovative devices and new architecture chips. The plan encourages R&D in new material devices, such as two-dimensional materials, and facilitates the design and tape-out of chips featuring three-dimensional stacked architectures.

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