After stepping away from the scene for more than a year, Xiaomi has reemerged with a bang, introducing three cutting-edge chips tailored for mobile phones, AI acceleration, and in-vehicle intelligent driving, respectively. This move underscores Xiaomi's strategic vision and comprehensive approach to independent chip R&D. Among these offerings, the Xuanjie O3 stands out as the flagship chip for mobile devices, leveraging a 3nm process to deliver a substantial boost in performance, enhanced energy efficiency, and state-of-the-art architectural design. Together, these features create a robust computing ecosystem. The Xuanjie O100, a 6nm AI acceleration chip, incorporates 3D wafer-level stacking technology to overcome the memory bottleneck commonly associated with large models, thereby facilitating the swift deployment of edge AI applications. Meanwhile, the Xuanjie D100, a 3nm in-vehicle intelligent driving chip, boasts formidable computing power and establishes a clearly defined in-vehicle computing architecture. These three chips are slated for commercial release in September of this year and next year, marking a significant leap forward for Xiaomi in mastering core technologies. This development will not only diminish reliance on external technologies but also pave the way for a seamless ecosystem that integrates software and hardware.