Intel's foundry business has made new progress, with SK Hynix, a major global memory manufacturer, potentially becoming a customer for Intel's EMIB advanced packaging technology to integrate next-generation high-bandwidth memory (HBM) products. At the Hot Chips 2026 conference, SK Hynix stated that it is collaborating with TSMC to integrate HBM memory into advanced packaging platforms such as CoWoS-L, CoWoS-S, and CoWoS-R, while Intel's EMIB is also being included in its next-generation packaging integration solutions.