On August 25th, news emerged that Guangli Technology revealed on an interactive platform that the company boasts cutting-edge technologies and products within the semiconductor packaging and testing equipment domain. These offerings encompass precision dicing and slicing mass production machinery, pivotal components (such as air spindles), and essential consumables (like blades). Guangli Technology provides all-encompassing dicing and grinding solutions to both domestic and international packaging and testing manufacturers, as well as IDM clientele.

Its subsidiary, ADT, has amassed decades of technical expertise in the soft blade sector and has been a longstanding blade supplier to global clients, including prominent packaging and testing enterprises. Presently, the company is intensifying its efforts to expand domestic production capacity for blade consumables. Domestically manufactured soft blades have already achieved small-scale sales, while hard blades are currently undergoing client verification.

Moreover, the company's laser grooving and laser stealth dicing equipment are tailored for specific applications within the semiconductor back-end packaging process. The laser grooving machine has successfully completed client verification, and the laser stealth dicing machine has performed trial cuts on numerous batches of customer samples. Guangli Technology is committed to accelerating product verification to clinch sales orders at the earliest opportunity.