On August 24, 2026, Lei Jun, CEO of Xiaomi, announced the launch of three self-developed chips, including the AI flagship SoC Xuanjie O3, the high-bandwidth AI acceleration chip Xuanjie O100, and the high-computing-power AI chip for intelligent driving Xuanjie D100. Among them, Xuanjie O100 adopts 6nm 3D wafer-level stacking technology, achieving an ultra-high bandwidth of 1.22TB/s and an end-side inference speed of up to 330TPS. It is planned for commercial use in 2027 and will be applied to the entire ecosystem of Xiaomi categories, including smartphones, cars, and robots.