On August 23, China Tungsten High Tech disclosed that its majority-owned subsidiary, Shenzhen Jinzhou Precision Technology Co., Ltd., is set to embark on a capacity expansion initiative for high-precision micro tools tailored for AI high-speed, high-frequency printed circuit boards (PCBs), with an anticipated annual production volume of 140 million units. This strategic move received the green light from the company's board of directors on August 20, 2026. The project is slated for a total investment of 190 million yuan, spanning a construction timeline of one year, and is projected to achieve full operational capacity in the subsequent year. Financially, Jinzhou will allocate 178 million yuan from its internal reserves and seek a bank loan of 11.5 million yuan to fund the endeavor. Based on projections, the project's financial internal rate of return (post-income tax) is estimated at 14.55%.