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Rapidus Unveils Advanced Packaging Roadmap: Achieving 600mm Panels and 8x Reticle Size Interposers by 2030
22 hour ago /
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Author：小编
At the 2026 OCP Asia-Pacific Summit, Japanese semiconductor company Rapidus unveiled its advanced packaging roadmap, planning to achieve 8-reticle-size interposer and 600×600mm panel-level processing technology around 2030.
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