On August 18, Jingxin Microelectronics made a significant stride by successfully receiving and powering on its two self-developed chips: the RapidIO 3.2 switching chip, SR1820, and the RapidIO 3.2-PCIe 4.0 bridging chip, ST0420. Remarkably, all core functionalities of these chips were fully operational within just one hour.

The SR1820, a cutting-edge low-latency switching chip, boasts a 24-port, 48-lane architecture, delivering a peak switching capacity of 600Gbps. It accommodates a single-lane speed range from 1.25 to 12.5Gbaud, doubling the switching performance of its predecessor. Moreover, it optimizes forwarding latency to a mere 100ns and introduces novel features such as plug-and-play functionality and congestion detection.

The ST0420, on the other hand, is designed to facilitate hardware-level bridging between PCIe and RapidIO protocols. It enables seamless conversion of dual-protocol transactions through an integrated address mapping engine. This chip supports 50Gbps line-rate conversion with latency under 200ns and incorporates RDMA (Remote Direct Memory Access) transmission capabilities.

When working in tandem, these two chips can achieve GPU Direct RDMA functionality in AI parallel computing scenarios. They construct high-I/O interconnection pathways, substantially reducing data transmission latency and enhancing multi-node collaborative computing efficiency. Consequently, they offer robust hardware support for real-time applications such as medical imaging and radar signal processing.

Jingxin Microelectronics' successful breakthrough signifies remarkable progress in the domestic RapidIO Gen3 switching chip sector. It achieves comprehensive coverage from switching to bridging—a domain that has long been reliant on imports in China.