On August 19th, JCET made a notable announcement regarding a significant leap forward in its research and development endeavors focused on high-aspect-ratio TSV (Through-Silicon Via) technology. This achievement was realized through successful sample trials conducted in collaboration with key partners. JCET's TSV manufacturing solution is strategically designed to cater to high-end applications, including but not limited to 2.5D/3D advanced packaging, silicon-based interconnections, and multi-dimensional heterogeneous integration. The primary objective behind this development is to bolster the company's core process capabilities within the microsystem integration framework, thereby offering a more holistic and adaptable one-stop manufacturing solution. This, in turn, will support the system-level integration of chips that demand high computational power and substantial storage capacity.