According to Taiwan's Economic Daily News, TSMC is currently grappling with a capacity crunch in its advanced packaging technology, CoWoS, due to an overwhelming influx of orders. Informed sources reveal that some of the orders for the latter stages of the advanced packaging process have been redirected to Intel's Malaysian facility, with both companies collaborating on partial capacity to collectively cater to key clients. This strategic move marks a departure from previous industry norms. In addition to streamlining TSMC's front-end advanced process shipments, industry analysts also foresee potential benefits for companies that share overlapping supply chains with these two industry giants. Notable among these are ASE Technology Holding, circuit board leader Unimicron, and Giatec Group. On August 18, industry insiders highlighted that the global bottleneck in advanced packaging capacity stems from the slower ramp-up speed of the latter stages compared to the front-end process. It is expected that TSMC will invite more suppliers to participate in the latter stages of capacity expansion to expedite front-end process shipments.