Gowin Semiconductor Unveils a Fully In-House-Developed Integrated Solution for USB 3.0/3.1
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Author:小编   

On August 14, Gowin Semiconductor announced the launch of a comprehensive, fully in-house-developed solution tailored for USB 3.0 and 3.1 interfaces. This innovative solution seamlessly integrates the PHY (Physical Layer) and Device controller into a single, compact chip, enabling dual-speed, high-speed data transmission capabilities at both 5Gbps and 10Gbps. The flagship device of this solution, the GW5AT-60, has achieved a significant milestone by successfully completing a full suite of compliance tests at the esteemed USB-IF authorized laboratory, Granite River Labs, on July 20, 2026. As a result, it has earned official certification (with TID number 16068) and fully complies with the international standards set forth for Type-C R2.4 and USB PD 3.2 V1.1.

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