FMS 2026 Insights: Koxin Semiconductor Breaks Through the AI Storage Wall with End-Side Edge Full-Scenario Innovations
2026-08-12 / Read about 0 minute
Author:小编   

Held from August 4 to 6 (local time) in Santa Clara, USA, the FMS 2026 Global Flash Memory Summit served as a significant platform for industry leaders to converge. During this event, Koxin Semiconductor made a notable impression by featuring four key product lines: embedded storage chips, SSDs, DRAM memory modules, and mobile storage solutions. These offerings represent a tailored Chinese approach to overcoming the 'storage wall' challenges that are increasingly pertinent in the realm of end-side AI applications.