Beyond its cutting-edge process technologies, TSMC has also carved out a leading role in the realm of advanced packaging in recent years. Its CoWoS (Chip-on-Wafer-on-Substrate) packaging technology, in particular, has garnered a significant share of AI chip orders. Recently, TSMC announced that its CoWoS packaging technology, featuring a 5.5x reticle size, has officially entered mass production. He Jun, TSMC's Vice President overseeing the advanced packaging business, revealed that the technology has demonstrated a stable yield exceeding 98% for AI chips among the majority of customers, with some achieving an impressive 99% yield.