On August 10, the structural completion ceremony for Advanced Micro-Fabrication Equipment Inc. China (AMEC)’s Chengdu R&D and production base and Southwest headquarters project took place in the Chengdu High-Tech Zone. The project boasts a total investment of approximately 3.05 billion yuan, with its first phase spanning 50 acres and encompassing a total construction area of about 70,000 square meters. It encompasses facilities such as an R&D center and a production base, and is slated to become operational by 2027. Focusing on the manufacturing needs of high-end logic and memory chips, the project is dedicated to the R&D and production of key thin-film equipment, including chemical vapor deposition (CVD) equipment and atomic layer deposition (ALD) equipment. This initiative aims to bolster the technological and capacity advantages of domestic semiconductor equipment. AMEC’s relevant project leader stated that this project marks a pivotal step in deepening the company’s strategic presence in Southwest China. By leveraging the favorable industrial ecosystem and business environment in the Chengdu High-Tech Zone, the company will capitalize on its core technological strengths in thin-film deposition to drive the development of essential equipment for advanced semiconductor manufacturing processes. A representative from the Chengdu High-Tech Zone noted that the AMEC Chengdu project will effectively stimulate local demand for supporting materials, components, and equipment for integrated circuits. This, in turn, will further enhance the regional industrial ecosystem and contribute to strengthening the resilience and security of industrial and supply chains.