As a standout forum at this expo, the Advanced Materials Innovation and Development Conference is centered around the theme "Shattering Interconnection and Heat Dissipation Barriers: Key Material Strategies for AI Heterogeneous Integration Packaging." The conference will delve into critical areas such as heterogeneous integration, glass substrates, and optical interconnection. It will concentrate on the latest innovation trends in data center computing chip packaging and offer an in-depth analysis of the industrial transformation towards "Beyond Moore's Law," propelled by high-performance computing (HPC).