On August 4, SK Hynix announced the joint release of the first standard specification for High Bandwidth Flash (HBF), a next-generation storage technology, in collaboration with SanDisk. This specification marks the first achievement after approximately six months of collaboration between SK Hynix and SanDisk, which began with the initiation of HBF standardization efforts in August last year and the subsequent establishment of an alliance in February this year. The specification defines two capacity configurations for 8-layer and 16-layer NAND chip stacking, supporting up to 512GB capacity. Additionally, it sets bandwidth standards across three tiers, with data transfer capabilities ranging from approximately 0.4TB/s to 3.0TB/s.