At the recent ChinaJoy event held in Shanghai, Zhao Jun, the Senior Vice President of TCL Technology and the CEO of TCL CSOT, disclosed that TCL CSOT has put together a specialized team to expedite the verification of crucial processes for glass substrate packaging. The company aims to present samples and set up a pilot production line in the latter half of this year. Concurrently, BOE has commenced sending samples from its pilot line for glass substrate packaging to domestic clients, with several customers successfully navigating conceptual certification and now progressing to the technical testing stage. Tianma, too, has established an MPG (Multi-Project Glass substrate) technology platform, with a strategic emphasis on advanced packaging as a pivotal enabler. As AI chips progress towards larger dimensions, enhanced computational capabilities, and higher-density interconnects, the capabilities of traditional organic substrates are gradually nearing their thresholds. Consequently, advanced glass substrate packaging has emerged as a fresh focal point within the industry, prompting panel manufacturers to actively pursue cross-border expansions.