In July 2026, BiBO Semiconductor successfully wrapped up its Series A+ funding phase, amassing a total financing sum that surpasses 900 million yuan. This latest funding round received joint backing from local state-owned asset platforms and strategic investment collaborators. The injected capital will be predominantly allocated towards ramping up the production scale of current chip offerings, broadening market reach, driving chip innovation and enhancements, and conducting preliminary research on pivotal 6G technologies.