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MediaTek Verifies the Utilization of Intel EMIB-T for ASIC Packaging
2026-08-03 /
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Author：小编
During its most recent financial conference, MediaTek revealed that, apart from employing TSMC's CoWoS packaging technology for its AI ASIC initiative, it has incorporated Intel's state-of-the-art EMIB-T packaging technology as well. This move broadens its packaging approaches to cater to the extensive AI chip design requirements of a diverse customer base.
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