CITIC Securities' research report highlights that advanced packaging will serve as a crucial pillar for the sustained and rapid performance enhancement of high-end chips in the future. Glass substrates are poised to become a pivotal technology in overcoming the current limitations of advanced packaging, particularly in terms of large-scale, high-density, high-speed, and efficient production. They are set to enter a phase of rapid maturation and volume expansion, with a highly promising market outlook. Notably, the trend of glass carrier boards penetrating the market is evident, indicating significant growth potential. Therefore, it is advisable to focus on investment opportunities within the industrial chain. Furthermore, areas such as glass interposers and glass carriers also demonstrate substantial growth prospects.