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Intel has made a significant breakthrough in oversized packaging technology at its New Mexico-based factory. Presently, the packaging size has been elevated to eight times the industry norm, measuring 240mm x 240mm, which is equivalent to 24 times the reticle size. Looking ahead, Intel has ambitious plans to scale this up to over 12 times the reticle size by 2028. Moreover, panel-level packaging is set to surpass an impressive 50 times the reticle size. This innovative technology allows for manufacturing processes that transcend reticle limitations through a method known as stitching. It facilitates the seamless integration of multiple computing modules and high-bandwidth memory, thereby offering high-density, low-latency solutions tailored for AI data centers and supercomputing applications.
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