Intel has made remarkable strides in advanced packaging technology, successfully addressing the fluid sealing challenges associated with ultra-large chip manufacturing packaging. This innovation enables the expansion of chip packaging sizes to up to 24 times the reticle limit, setting the stage for the next generation of ultra-large-scale integrated systems. Presently, Intel's facility in New Mexico has already achieved packaging sizes up to 8 times the industry norm, with ambitious plans to extend this to over 12 times by 2028. The ultra-large chip packaging size reaches an impressive 240mm × 240mm, boasting a reticle size that is 24 times larger, outperforming all existing technologies with the exception of panel-level packaging. Intel is persistently driving packaging technology innovation forward, with its recent roadmap indicating a breakthrough to 12 times the reticle size. Meanwhile, panel-level packaging technology is poised to achieve a breakthrough of over 50 times the reticle size.