In the realm of 5G-Advanced and 6G millimeter-wave wireless communication networks, the development of RF front-end microsystems that boast high operational frequencies, minimal signal transmission losses, and a high degree of miniaturization is pivotal for surmounting the physical constraints inherent in monolithic integration. Glass interposers, characterized by their exceptionally low dielectric losses, superior flatness, and adjustable coefficient of thermal expansion, have emerged as the optimal solution for millimeter-wave RF heterogeneous integration. Nevertheless, the conventional laser ablation technique employed in glass processing often results in sidewall cracks and elevated roughness. Furthermore, the surface roughness of high-temperature copper-plated redistribution layers can intensify skin effect losses within the millimeter-wave frequency range, thereby constraining the practical deployment of high-performance RF microsystems.