Hongban Technology has revealed that its wholly-owned entity, Ganzhou Hongban, is set to invest in the establishment of a high-end mSAP precision circuit board industrialization project, with the total estimated investment capped at 5 billion yuan. The financial resources for this endeavor will be drawn from the company's internal reserves and funds raised independently. This project is strategically designed to refine the company's product lineup and bolster its competitiveness and profitability within the high-end PCB (Printed Circuit Board) market. The construction timeline for the project spans 48 months, with an anticipated commencement date in January 2027. Once finalized, the project will concentrate on manufacturing high-end HDI (High-Density Interconnect) and mSAP precision circuit boards, primarily catering to the needs of premium clientele in both domestic and international high-end electronics industries.