On the evening of July 15, Shijia Photonics unveiled a private placement scheme slated for 2026, with the objective of raising up to 2.8 billion yuan from a maximum of 35 targeted investors. The proceeds from this funding initiative will be earmarked for several key projects: expanding the production capacity of high-speed AWG chips and optical interconnect components, advancing the industrialization of continuous-wave laser chips and COC (Chip on Carrier) technologies, increasing the manufacturing capacity of high-density optical interconnect devices, and bolstering working capital reserves.
