Recently, Horizon Robotics has entered into a strategic cooperation pact with Shanghai Tongtu Semiconductor, a key subsidiary of Pathfinder. Together, they will embark on collaborative development efforts, focusing on large-model bandwidth compression technology, to facilitate the seamless integration of expansive models into end-side applications, including intelligent driving and robotics. This significant step signifies Tongtu's full-scale large model compression technology officially moving from the technical pre-research phase to industrial-scale deployment. Tongtu has established a comprehensive compression system that operates across three distinct tiers: input data, intermediate states, and model parameters. This innovative system directly tackles the memory wall bottleneck within AI computing systems, which is primarily caused by data transfer issues, thereby effectively eliminating the transmission limitations between computational power and storage.