Fueled by the rapid expansion of AI technology, the global demand for advanced chips has skyrocketed. However, the supply remains restricted due to the technological prowess and production capacities of a select few companies. According to a report on the U.S.-based Forbes biweekly website, the advent of emerging technologies is poised to significantly transform the global manufacturing landscape of advanced chips by 2030. Presently, EUV (Extreme Ultraviolet) lithography stands as the dominant technology. Nevertheless, cutting-edge alternatives such as atomic lithography, X-ray lithography, and xLight technology are on the brink of widespread adoption, potentially ushering in an era where EUV lithography is no longer the sole frontrunner.

Atomic lithography, for instance, leverages atomic beam etching to shrink feature sizes by one to two orders of magnitude. X-ray lithography, with its shorter wavelength, holds the theoretical potential to etch even smaller transistors. Meanwhile, xLight technology aims to seamlessly integrate with the existing technological ecosystem. In addition to these advancements, Huawei has unveiled the development of a novel semiconductor architecture that circumvents the need for extreme ultraviolet lithography, paving the way for the production of cutting-edge AI chips.