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TSMC Unable to Meet CoWoS Demand, Advanced Packaging Orders Overflow to Intel and Local Competitors
2026-07-12 /
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Author：小编
The surging demand for artificial intelligence and high-performance computing chips has posed significant capacity challenges for TSMC, the global leader in semiconductor manufacturing. According to industry sources, TSMC is facing a severe shortage in its CoWoS advanced packaging capacity, leading to a substantial overflow of orders. This situation has allowed competitors like Intel and several Taiwanese local packaging and testing firms to secure a large number of orders.
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