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Report: Samsung Electronics and SK Hynix Reportedly Delay the Implementation of Hybrid Bonding Packaging Technique
11 hour ago /
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Author：小编
Initially, Samsung Electronics and SK Hynix had set their sights on integrating hybrid bonding technology into HBM4. However, circumstances have changed. With the industry easing the thickness requirements for HBM and facing setbacks in customer demand for high-layer stacking, both companies have opted to stick with the conventional thermocompression bonding technique for the time being. According to industry insiders, the earliest application of hybrid bonding technology is anticipated to be in the 16-layer HBM4E.
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