On July 6, WUS Printed Circuit issued an announcement detailing its investor relations activities. The announcement revealed that the company intends to allocate approximately RMB 4.3 billion in the fourth quarter of 2024 to launch a new expansion initiative focused on high-end printed circuit boards tailored specifically for AI chips. (Note: Here, "matching" is translated in a way that emphasizes the customization and compatibility of the printed circuit boards for AI chips.) The project, which is currently advancing in an orderly fashion, is slated to break ground in late June 2025. Trial production is expected to kick off in the latter half of 2026, with a phased increase in production capacity to follow. At the outset of product development for end customers, the company takes a proactive stance by fully engaging in the process. It conducts electrical performance verification and reliability testing of next-generation high-end materials well in advance. This strategy is aimed at shortening the material certification cycle and securing priority access to material quotas during periods of supply scarcity. Additionally, the company maintains a strategic safety stock of critical materials, promotes diversification and localization of material certification, mitigates the risk of raw material supply disruptions, and fortifies the security of its supply chain.