According to foreign media reports, which referenced an analysis from SemiAnalysis, Google's upcoming Tensor Processing Unit (TPU) will shift away from TSMC's Chip-on-Wafer-on-Substrate (CoWoS) packaging technology, opting instead for Intel's Embedded Multi-die Interconnect Bridge-Thermal (EMIB-T) technology. This innovative approach leverages embedded silicon bridges and through-silicon vias (TSVs) to establish vertical interconnections, thereby lowering packaging expenses and boosting power supply efficiency. Google intends to commission Intel with the manufacturing of more than 3 million TPUs by 2028. In this arrangement, MediaTek will be in charge of the I/O and back-end design, while Marvell will supply custom network chips. Although Intel's EMIB-T technology has achieved a yield rate of 90%, it still falls short of the industry standard of 98%, indicating that there are technical hurdles to overcome before mass production can commence. This strategic move is poised to disrupt TSMC's dominance in the AI advanced packaging market and usher in an era where CoWoS and EMIB-T technologies coexist as dual pathways in the industry.