On June 30, BOE A revealed during an investor research session that the company has been deeply engaged in technological research on glass substrate carriers since 2020. In 2022, it made a substantial investment of RMB 390 million to establish a cutting-edge, wafer-level experimental platform that seamlessly integrates both glass-based and silicon-based technologies. Moving forward to 2024, the company furthered its commitment by investing an additional RMB 993 million to construct a state-of-the-art, panel-level pilot line for glass substrate packaging carriers. This pilot line is on track to complete the installation and commissioning of its primary equipment by 2025, with full automation equipment line connectivity slated for the first half of 2026. Designed with a robust production capacity, the line is projected to manufacture 1,000 units per month.

Currently, BOE A has attained mastery over the entire process technology for glass substrate packaging carriers. This encompasses a range of sophisticated techniques, including Through-Glass Via (TGV) formation, deep via copper filling, build-up layers, and intricate wiring. In a significant milestone in 2025, the company successfully developed large-size, high-layer-count (9-2-9, 20-layer) glass substrate carrier samples. These samples have already been provided to select domestic customers for evaluation. Impressively, some of these customers have not only passed the conceptual certification but have also advanced to the technical testing phase. However, it is important to note that as of the present moment, this business segment has not yet transitioned into mass production or commenced generating revenue from volume production activities.