On June 30, Counterpoint Research unveiled its latest Foundry Supply Tracker report, revealing that in the first quarter of 2026, the global foundry 2.0 market revenue soared by 23% year-on-year, reaching a staggering $86 billion. This remarkable growth was predominantly fueled by the robust demand for AI GPUs and AI ASICs. Such demand not only propelled the need for advanced process wafers but also enhanced the capacity utilization for advanced packaging. The ongoing AI investment cycle is fundamentally reshaping the semiconductor value chain, propelling the industry swiftly into the 'Foundry 2.0' epoch. At the heart of this new era is the profound integration of wafer fabrication, advanced packaging, and testing capabilities. TSMC, emerging as the chief beneficiary of this transformative trend, maintains its leading position in the market. Concurrently, with advanced packaging capacity emerging as a pivotal bottleneck in the AI supply chain, leading Outsourced Semiconductor Assembly and Test (OSAT) companies are also encountering increased growth prospects.