On June 29th, reports emerged from an on-site visit indicating that Shenghong Technology has already initiated mass production of certain ASIC-related PCB products, with business operations proceeding seamlessly. The company has set up an mSAP workshop in Huizhou, with its current production capabilities tailored specifically to meet the manufacturing requirements of 1.6T optical modules. With a robust pipeline of orders, the company's capacity utilization rate remains at a healthy level. In light of the high demand for mSAP production capacity, Shenghong Technology is maintaining close communication with its customers to strategically plan its production capacity in alignment with market needs. Moreover, the company is actively engaged in the research and development of CoWop technology, which necessitates the integration of cutting-edge HDI and mSAP processes. This innovation is anticipated to substantially elevate the value proposition of its related PCB products. Presently, the second-phase high-end production capacity of Building A1 in Thailand has successfully cleared audits conducted by multiple customers and is now engaged in the production of verification boards for AIPCB products.