On June 26, news emerged that during the fourth session of its inaugural board of directors' meeting and the second extraordinary general meeting of shareholders in 2024, JCET Semiconductor Technology (Shanghai) Co., Ltd. (JCET STS) ratified the 'Proposal for Investing in the Construction of the JCET STS Lingang Advanced Packaging Production Line Project'. This paves the way for investment in the Dongshenghexin 3D Integrated Chip Manufacturing (Phase I) endeavor. The total investment for this project is projected to hover around 10 billion yuan, with the precise figure to be finalized based on actual expenditures and will be infused in stages, aligning with the project's construction timeline. Presently, the project is in full swing, undertaking all preparatory tasks ahead of its launch. It is anticipated to officially kick off on June 29, following the completion of necessary formalities in the days leading up to it.